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Polishing of Silicon wafers

 
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Saurav
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PostPosted: Sun Dec 05, 2004 9:26 am    Post subject: Polishing of Silicon wafers Reply with quote

Hi,
I have come across a technological development where we are able to develop nanosilicates at a very cheap price ... but we are not aware of its importance in polishing industry of these nanosilicates. Can someone please enlighten us ...

Regards,
Saurav

Below are some of our results:

Rice husk contains more than 95% Si and is highly friable. In the electronic industry there has been tendency to use silica smoke slurry for abrasive polishing of copper circuits printed over silica. Present work is an attempt to study and evaluate the fine abrasive polishing power of rice husk ash and to replace silica smoke by rice husk ash powder.
Because of ultra-miniaturization of micro electronic component, silicon wafer planarization has assumed enormous importance. A set of abrasives, based on smoky silicon and amorphous alumina, are now available in the western market. The idea is to develop abrasive of similar or better properties, starting from agriculture waste and replace the former with much cheaper product.

Procedure (brief summary)
Rice husk ash silica was produced at different temperatures of firing. Analysis and correlation study of parameters like processing temperature, internal surface area, porosity and pore size/pore volume distribution was done. The X-Ray diffraction pattern of the product has been carried out at each stage to establish the solid-state structure.

Relevant Results
Given below are the gross results:
i) Size of particle produced
a) For grinded rice husk particles (RHA): 30nm
b) For Rice Husk Ash-Alumina composite (RHA-Alumina): 22nm

ii) Comparison of fine abrasive polishing of RHA and RHA-Alumina composite:

Sample Time taken by RHA Time taken by RHA-Alumina composite
Fe-0.2%C 23 minutes 17 minutes
Silicon Wafer 122 minutes 85 minutes

Micrographs of samples polished by these two abrasives were free of scratches.

Business Benefits:
Drastic reduction of cost of polishing silicon wafer as the raw materials required for producing polishing abrasive (nanosilicates) are very cheap and the infrastructure required (not discussed here) is also very cheap.
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PostPosted: Sun Dec 05, 2004 9:28 am    Post subject: Re: Polishing of Silicon wafers Reply with quote

Saurav wrote:
Hi,
I have come across a technological development where we are able to develop nanosilicates at a very cheap price ... but we are not aware of its importance in polishing industry of these nanosilicates. Can someone please enlighten us ...

Regards,
Saurav

Below are some of our results:

Rice husk contains more than 95% Si and is highly friable. In the electronic industry there has been tendency to use silica smoke slurry for abrasive polishing of copper circuits printed over silica. Present work is an attempt to study and evaluate the fine abrasive polishing power of rice husk ash and to replace silica smoke by rice husk ash powder.
Because of ultra-miniaturization of micro electronic component, silicon wafer planarization has assumed enormous importance. A set of abrasives, based on smoky silicon and amorphous alumina, are now available in the western market. The idea is to develop abrasive of similar or better properties, starting from agriculture waste and replace the former with much cheaper product.

Procedure (brief summary)
Rice husk ash silica was produced at different temperatures of firing. Analysis and correlation study of parameters like processing temperature, internal surface area, porosity and pore size/pore volume distribution was done. The X-Ray diffraction pattern of the product has been carried out at each stage to establish the solid-state structure.

Relevant Results
Given below are the gross results:
i) Size of particle produced
a) For grinded rice husk particles (RHA): 30nm
b) For Rice Husk Ash-Alumina composite (RHA-Alumina): 22nm

ii) Comparison of fine abrasive polishing of RHA and RHA-Alumina composite:

Sample Time taken by RHA Time taken by RHA-Alumina composite
Fe-0.2%C 23 minutes 17 minutes
Silicon Wafer 122 minutes 85 minutes

Micrographs of samples polished by these two abrasives were free of scratches.

Business Benefits:
Drastic reduction of cost of polishing silicon wafer as the raw materials required for producing polishing abrasive (nanosilicates) are very cheap and the infrastructure required (not discussed here) is also very cheap.
Please reply on [email protected]
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