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Posted: Thu Dec 23, 2004 2:37 am Post subject: Heat Transfer Compound |
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It seem there are many different heatsink compounds on the market, silicon, zinc, hardsetting etc. None of these seem to have a thermal transfer co-efficient on the tube.
Which is the best compound to use for a NEC FS- series television, verticle output IC? It took a tyre lever to remove the old IC from the heatsink.
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Joined: 26 Nov 2004 Posts: 29 Location: Tennessee, USA
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Posted: Mon Dec 27, 2004 3:18 pm Post subject: |
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It doesn't really matter, but I would suggest not using a hard setting heat sink compound for any unit that isn't going to be severely shaken quite regularly. _________________ visit Singles Places dating site
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Posted: Tue Dec 28, 2004 11:02 pm Post subject: |
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Thankyou,
It says that the hard setting compound (as used in monitors and such) increases the thermal conductivity to the max.
We use the zinc compound extensively in industry.
My guess it that the silicon compound is used where the device is insulated from the heatsink.
I cannot find any thermal conductivity figures on any of these compounds.
Merry Christmas all:) |
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Joined: 26 Nov 2004 Posts: 29 Location: Tennessee, USA
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Posted: Wed Dec 29, 2004 12:46 am Post subject: |
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Vertical output IC's should never be designed so critically that the heat sink compound is a factor at all in why it may fail prematurely. That's just plain criminal. There is plenty of room in a TV or Monitor to incorporate one that would last indefinitely, and without any heat sink compound at all. But if this is the case, then I feel damn sorry for this advanced society of ours.
I've used plenty of both silicone and zinc, but the only reason I preferred zinc is because of it's tacky consistency, I never even bothered about knowing what the conductivity was... and didn't care, I've always figured it was just common sense that it shouldn't really matter, and to my knowledge, it never did. I quit repairing about 5 years ago after 19 years of 8 to 5, 5 days a week. I've never had a callback where I actually suspected the brand or type of heat sink compound to be the cause, or reason for return to the shop at all. I would much sooner blame the IC design, and in fact always did and nothing else, unless of course it was an external problem that was the cause.
It's like..
..well, you need to use the proper heat sink compound ...
um, excuse me.... no ............... YOU need to design a friggin Vert IC PROPERLY!
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Posted: Fri Dec 31, 2004 5:16 am Post subject: |
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Thanks for your reply, I will use the compound I have:)
Happy New Year and may the new year bring you much happiness and laughter!
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Joined: 26 Nov 2004 Posts: 29 Location: Tennessee, USA
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